A heat dissipation device includes a base, a first heat sink located on the base, a second heat sink located on the first heat sink, and a heat pipe contacting with the base and the first and second heat sink. The first heat sink includes a heat spreader and a plurality of fins extending from the heat spreader. The second heat sink includes a heat spreader and a plurality of fins extending from the heat spreader. The heat pipe includes an evaporating portion, first and second condensing portions parallel to the evaporating portion and first and second connecting portions interconnecting corresponding first and second condensing portion and the evaporating portion. The evaporating portion and the first condensing portion are located between the base and the heat spreader of the first heat sink. The second condensing portion is located on the heat spreader of the second heat sink.