Disclosed herein is a semiconductor device including: an insulating film
configured to be provided on a substrate and be porosified through
decomposition and removal of a pore-forming material; a covering
insulating film configured to be provided on the insulating film; and
conductive layer patterns configured to be provided in the covering
insulating film and the insulating film and reach the substrate, wherein
the insulating film includes a non-porous region in which the
pore-forming material remains.