Provided is a room temperature-curable, heat-conductive silicone rubber
composition, including: (A) a diorganopolysiloxane with both molecular
chain terminals blocked with hydroxyl groups and/or organooxy groups, (B)
a heat-conductive filler other than a palladium powder, (C) an
organosilane containing two or more hydrolyzable groups, and/or a partial
hydrolysis-condensation product thereof, and (D) a palladium powder. The
composition improves on the drawbacks of the conventional technology, is
able to suppress the quantity of hydrogen gas produced from the
heat-conductive filler, exhibits superior storage properties, and yields
a low-hardness cured product upon curing. The cured product is useful as
a heat-conductive material for a heat-generating electronic component.