Disclosed herein is a BGA-type test and burn-in socket for ICs. The socket includes contacts, a socket body, a cover, a slide, and an IC holder. The socket body has contact holes to receive the contacts, and positioning pins to secure the socket body to a PCB. A stopper, receiving a contact body, and a lead guide, guiding a contact lead, are provided on the lower portion of the socket body, and the slide and the cover are provided on the upper portion of the socket body. The cover includes holder rotating pins, and open cams and closure cams to move the slide. The slide includes open cam contact parts contacting the open cams when the cover is pressed down, and closure cam contact parts contacting the closure cams when the cover moves upwards. The IC holder moves downwards by the holder rotating pins, thus pressing an IC.