A heat sink clip for securing a heat sink to a heat generating electronic component includes a spring member including an elongated main body. A connecting portion is formed at one end of the main body and a first locking leg extends from the other end thereof. A second locking leg is coupled to the connecting portion of the spring member. An actuating member connects pivotally with the second locking leg. An assisting member, which is located between the actuating member and the connecting portion, includes a wedged main body. When the actuating member is rotated from a first orientation to a second orientation, the assisting member horizontally moves a distance thereby moving the actuating member to a raised level. The actuating member has teeth engaging with teeth formed on an inclined face of the wedged main body.