An interconnect array formed at least in part using repeated application of an interconnect pattern is described. The interconnect pattern has at least ten interconnect locations. One of the ten interconnect locations is for a power interconnect. Another one of the ten interconnect locations is for a ground interconnect. At least eight interconnect locations remaining are for additional interconnects. The at least eight remaining interconnect locations are disposed around a medial region, where either the ground interconnect or the power interconnect is located in the medial region. An offset region has one of either the ground interconnect or the power interconnect not in the medial region. The interconnect array is at least partially formed by repeated application of the interconnect pattern offset from one another responsive to the offset region.