In a method and in an apparatus for the placement of electronic components
(1) onto a substrate (2) at a placement station (3), the component
bearing by a bearing side (4) at a supply station is picked up by means
of a primary tool (6) and is transported away by means of a rotational
movement and is transferred to at least one pivoting tool (41, 42). In
this case, the path of the component between the plane (47) of the supply
station and a provision plane (7) located at a higher level is covered in
at least two separate curve movements. In the provision plane, the
component is accepted by at least one secondary tool, is transported over
the substrate and is deposited there. Depending on whether the primary
tool transfers the component first to an intermediate pivoting tool (41)
or directly to a final pivoting tool (42), the component can be placed
onto the substrate once again by the same bearing side or else by its
structure side.