In a method and in an apparatus for the placement of electronic components (1) onto a substrate (2) at a placement station (3), the component bearing by a bearing side (4) at a supply station is picked up by means of a primary tool (6) and is transported away by means of a rotational movement and is transferred to at least one pivoting tool (41, 42). In this case, the path of the component between the plane (47) of the supply station and a provision plane (7) located at a higher level is covered in at least two separate curve movements. In the provision plane, the component is accepted by at least one secondary tool, is transported over the substrate and is deposited there. Depending on whether the primary tool transfers the component first to an intermediate pivoting tool (41) or directly to a final pivoting tool (42), the component can be placed onto the substrate once again by the same bearing side or else by its structure side.