A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate plate and fins extend from each of the elongate plates. Ventilation holes are defined through each the elongate plates and located between the fins. The memory chip is sandwiched between the first and second elongate plates of the first and second parts, and the fins of the two parts are arranged alternatively.