An integrated circuit package may include a substrate and an integrated
circuit. The substrate may include at least one region, and a first
magnetic material associated with the at least one region. The integrated
circuit may have a second magnetic material associated therewith. The
second magnetic material may be attracted to the first magnetic material
to coupled the integrated circuit to the at least one region of the
substrate. The IC package may be utilized in an RFID tag of an RFID
system. An associated method for assembling an integrated circuit to a
substrate is also provided.