A blade computing system is provided according to an embodiment of the invention. The blade computing system includes a substrate, at least one capacitive communication system formed on the substrate and configured to capacitively exchange data communications, and at least one inductive power system formed on the substrate and configured to inductively receive electrical power. The blade computing system further includes one or more baffles formed on the substrate and positioned between a capacitive communication system of the at least one capacitive communication system and an inductive power system of the at least one inductive power system. The blade computing system further includes a processing system formed on the substrate and coupled to the inductive power system and the capacitive communication system.