A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, which is to be cooled, on the respective printed circuit board or plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The component feed line and the component return-flow line have coupling elements attached at ends of the respective printed circuit board or plug-in module which, together with the counter coupling elements of the feed line and the return-flow line attached at the end of the housing, form a coupling connection, which is releasable.