A method of manufacturing a multilevel interconnect structure using a
screen printing method is disclosed. In the multilevel interconnect
structure, an interlayer insulating film having a through hole with a
conductive bump therein, and a second interconnect line are stacked on a
substrate with a first interconnect line formed thereon. The first
interconnect line is electrically connected to the second interconnect
line via the conductive bump. The method includes a step of forming a
first region of the interlayer insulating film on the substrate with the
first interconnect line formed thereon, the first region including a part
of a peripheral wall of the through hole; a step of forming a second
region of the interlayer insulating film on the substrate with the first
region formed thereon, the second region including a remaining part of
the peripheral wall of the through hole; and a step of forming the
conductive bump.