A conductive adhesive composition is provided and articles that include
the adhesive composition as a component thereof. The conductive adhesive
composition comprises: (a) pressure sensitive adhesive; (b) electrolyte
comprising water soluble or water dispersible organic chloride; and (c)
humectant. In some embodiments, the conductive adhesive composition is a
bicontinuous composition comprising an aqueous phase and an oil phase,
and the bicontinuous composition may be derived from a polymerizable
microemulsion composition, the microemulsion composition comprising: an
aqueous phase comprising one or more hydrophilic monomers or oligomers
and/or one or more amphiphilic monomers or oligomers in water, the
water-soluble or water-dispersible organic chloride, surfactant and
humectant; and an oil phase comprising one or more hydrophobic monomers
or oligomers. Biomedical articles such as biomedical electrodes, may
incorporate the foregoing adhesive as a component.