A liquid-crystalline polymer composition with less warpage not only in molding but also in a high temperature treatment conducted after molding is provided. The liquid-crystalline polymer comprises (i) 30 to 95% by weight of a first liquid-crystalline polymer having a deflection temperature under load of 200.degree. C. or higher and (ii) 5 to 70% by weight of a second liquid-crystalline polymer having a deflection temperature under load lower than that of the first liquid-crystalline polymer, a melting point from 270.degree. C. to lower than 400.degree. C. and a flow-beginning temperature of 270.degree. C. or higher.

 
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