A method for making substrates for use in optics, electronics, or
opto-electronics. The method may include transferring a seed layer onto a
receiving support and depositing a useful layer onto the seed layer. The
thermal expansion coefficient of the receiving support may be identical
to or slightly larger than the thermal expansion coefficient of the
useful layer and the thermal expansion coefficient of the seed layer may
be substantially equal to the thermal expansion coefficient of the
receiving support. Preferably, the nucleation layer and the intermediate
support have substantially the same chemical composition.