A compact camera module (CCM) substantially includes a substrate, a sensor chip and a lens module. The substrate has a surface defining a chip-attached area for attaching the sensor chip and a module-secured area for mounting the lens module. A check point is defined in the chip attached area. The module-secured area surrounds the chip-attached area. The substrate includes a plurality of connecting pads and a plurality of check bars disposed outside the chip-attached area, wherein the perpendicular bisectors of the check bars intersect with each other at a point aligning with the check point. Accordingly, a self-check step can be performed to check the center of the sensor area of the sensor chip in accordance with the intersection point after a chip is attached.