A semiconductor package and a method for manufacturing the same capable of
supplying power easily without an increase in the number of pads for
power supply. The semiconductor package includes a semiconductor chip
having a plurality of pads including pads for power supply disposed in a
center portion and an internal wiring disposed to be exposed to outside;
an insulating film formed on the semiconductor to expose the pads for
power supply and the internal wirings; and re-distribution lines formed
on the insulating film to connect between the exposed portions of the
pads for power supply and the internal wiring.
