A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component (30A), with a solder bump electrode (31) containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating a wiring board (X'), with an electrode section (21) corresponding to the solder bump electrode (31), to a second temperature lower than the first temperature. The method further includes a joining step for joining the solder bump electrode (31) and the electrode section (21) by pressing the electronic component (30A) against the wiring board (X'), with the solder bump electrodes (31) and the electrode sections (21) abutting against each other.