A method for making a patterned SiO.sub.2 films over TiO.sub.2
(Si0.sub.2/Ti0.sub.2) under ambient atmospheric conditions, including
room temperature, through photo and chemical reactions. The method is
simple, convenient and can be performed in a short period of time,
typically less than two hours. The patterned TiO.sub.2 film is fabricated
through photo-irradiation of a photosensitive organic-titanium film using
a mask. Silica particles are generated from silicate solution by
adjusting pH values to 10 to 8 with hydrochloric acid. The pre-deposited
TiO.sub.2 film has a strong attraction for the SiO.sub.2 particles,
leading to the instant formation of SiO.sub.2 film over the TiO.sub.2
film. The silica films are also amino-silylated with
3-aminopropyltriethoxysilane toward applications such as patternable,
location-specific silica-based separation and purification.