Systems and methods are disclosed to process a semiconductor substrate by fabricating a first layer on the substrate using semiconductor fabrication techniques; fabricating a second layer above the first layer having one or more NANO-bonding areas; self-assembling one or more NANO-elements; and bonding the NANO-elements to the NANO-bonding areas.

 
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> Method to manipulate selectivity of a metal oxide sensor

> Organic semiconductor device, field-effect transistor, and their manufacturing methods
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