An exposure processing system comprises an exposure apparatus to expose a
resist on a wafer, a heating apparatus comprising heating apparatus
units, the heating apparatus heating the exposed resist by a heating
apparatus unit in the heating apparatus units, a developing apparatus
comprising developing apparatus units, the developing apparatus
developing the exposed and heated resist by a developing apparatus unit
in the developing apparatus units, and a control apparatus to control the
exposure apparatus by using correction data so that a wafer on process
object being exposed, the correction data being data for correcting a
dimensional dispersion of a resist pattern caused by a pair of heating
apparatus unit and developing apparatus unit used for the wafer on the
process object, the pair of heating and developing apparatus unit
comprising a heating and developing apparatus unit in the heating and
developing apparatus used for the wafer on the process object.