A semiconductor component has a leadframe, a semiconductor die and an encapsulation element. The leadframe has a die pad having a first side, at least one lead spaced at a distance from the die pad and at least one support bar remnant protruding from the die pad, each having a distal end. The encapsulation element has plastic and encapsulates at least the semiconductor die and a portion of the first side of the die pad. At least one support bar remnant is positioned within the encapsulation element and the distal end of the support bar remnant is encapsulated by at least one dielectric compound.