Systems and methods for forming patterns and structures in target materials are described. The method produces a pattern or structure in a target material by contacting a stamp including one or more features with a target material using a normal load sufficient for keeping the one or more features in contact with the target material, and providing a cyclic shear force in an amount sufficient to extrude the target material and form a negative relief of the one more features in the target material. The systems and methods can be used to produce a variety of articles including, but not limited to, semiconductor integrated electrical circuits, integrated optical, magnetic, mechanical circuits and microdevices.