Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer caused by pressurization, further reduce chipping in grinding and cutting processes, be easily peeled off from a processed article after processing, and can be easily applied to an adhered at ordinary temperature. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate, the heat-expandable pressure-sensitive adhesive layer containing a foaming agent and having a shear modulus (23.degree. C.) in an unfoamed state of 7.times.10.sup.6 Pa or more. The adhesive sheet further includes a pressure-sensitive adhesive layer being arranged on or above heat-expandable pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a shear modulus (23.degree. C.) of less than 7.times.10.sup.6 Pa and a thickness of 0.01 to 10 .mu.m.

 
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< Conductive laminated film

> Curable composition

> Phase change inks containing photoinitiator with phase change properties and gellant affinity

~ 00569