It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

 
Web www.patentalert.com

< Soldering method for semiconductor optical device, and semiconductor optical device

> Capacitor of dynamic random access memory and method of manufacturing the capacitor

> Interconnects with harmonized stress and methods for fabricating the same

~ 00570