Disclosed is a curable resin composition which contains a copolymer; and an organic solvent having a boiling point of 180.degree. C. or higher at atmospheric pressure, which copolymer contains monomer units (A) having an alkali-soluble group, and monomer units (B) corresponding to curable group-containing polymerizable unsaturated compounds. The copolymer contains the monomer units (B) in a content of 5 to 95 percent by weight, based on the total weight of monomer units constituting the copolymer, and the monomer units (B) contain 30 percent by weight or more of monomer units corresponding to at least one compound selected from compounds containing an 3,4-epoxytricyclo[5.2.1.0.sup.2,6]decane ring. The curable resin composition gives a coat which is superior typically in transparency and thermal stability and does not suffer from uneven thickness and coating defects particularly when the composition is applied through slit coating or ink-jet coating.