Disclosed is a modular light emitting diode (LED) light pod having heat dissipation structures. A reflective optic plate, which may be made in various modular sizes and designs, having a plurality of recesses is seated on an LED board having a plurality of LEDs, such that the plurality of LEDs fit within the plurality optical recesses. The optical recesses serve to collimate light in a desirable manner based on predetermined dimensional ratios of the optical recesses. A heat dissipation system involves a heat sink housing acting in combination with a heat extraction plate having a plurality thermally conductive posts extending perpendicularly from a top and bottom surface, and a heat dissipation plate to create a thermally conductive path for moving heat away from the LED board when the light pod is in use.