The present invention relates to a non-aqueous conductive nanoink composition including 20 to 85 parts by weight of metal nanoparticles which is chosen from silver, copper, nickel, platinum, palladium, and gold; 0.5 to 10 parts by weight of a polymer having an anhydride group; 15 to 80 parts by weight of a non-aqueous organic solvent.The non-aqueous conductive nanoink composition of the present invention prevents cracks during the drying process, increases the adhesion between wiring and substrate, and allows forming conductive wirings and films without cracks and delamination on the substrate such as polymer including polyimide and glass or silicon wafer.