Disclosed are methods, systems, and structures for implementing interconnect modeling by using a test structure which include a variation of physical wire structures between local interconnects and distant interconnects. According to one approach, the impact of variations of the physical properties for neighborhood wires are considered for the electrical modeling of interconnects. This variation between the local and distant wire characteristics allows more accurate and robust interconnect modeling to be created.

 
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> Thin film transistor array substrate, method for manufacturing the same and system for inspecting the substrate

> Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices

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