An apparatus and method for wafer level fabrication of high value inductors directly on top of semiconductor integrated circuits. The apparatus and method includes fabricating a semiconductor wafer including a plurality of dice, each of the dice including power circuitry. Once the wafer is fabricated, then a plurality of inductors are fabricated directly onto the plurality of dice on the wafer and are in electrical contact with a switching node of the power circuitry on each die respectively. The inductors are fabricated by forming a plurality of magnetic core inductor members on an interconnect dielectric layer for each die on the wafer. An insulating layer and then inductor coils are then formed over the plurality of magnetic core inductor members over each die. A layer of magnetic paste is also optionally provided over each inductor coil to further increase inductance.