A process of manufacturing parallel-plate microstructures by integrating the microstructures in a chip using a CMOS process is provided. A MEMS variable capacitor, a tunable band-pass filter, tunable matching networks, and capacitive RF-MEME switches all having vertically movable components and are integrated into a chip.

 
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> Variable Capacitance Capacitor Array, Variable Capacitance Capacitor Array Device and Circuit Module

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