The present invention provides a low-cost and highly heat-radiating
lighting system and a display apparatus using the same. The lighting
system has a plurality of packages, each containing LEDs, lead frames and
a transparent sealing material, a heat-radiating substrate and an
adhesive layer adapted to bond the packages and the heat-radiating
substrate. The lead frames are 0.1 mm or more in thickness. Further, the
area of the surfaces of the heat-radiating substrate and the lead frames
bonded together via the adhesive layer is 70 mm.sup.2 per 1 mm.sup.2 area
of the LEDs. The display apparatus of the present invention uses the
lighting system as the backlight thereof.