A method of patterning a substrate according to several steps, including: a) mechanically locating a first masking film over the substrate; and b) segmenting the first masking film into a first masking portion and one or more first opening portions in first locations. Next, mechanically locate a first removal film over the first masking portion and first opening portions. Afterwards, one or more of the first opening portions are adhered to the first removal film. The first removal film and one or more of the first opening portions adhered to the first removal film are mechanically removed to form one or more first openings in the first masking film. Finally, materials are deposited over the substrate through the first openings in the first masking film.