A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has wedges that are similarly arranged in rows, with the wedges used to carry I/O placed closest to the circuit die. As a result, lowest-tiered bond wire is used to connect the I/O-related pads to their respective wedges.