An apparatus of this invention includes: a workpiece holding mechanism
that holds a ring frame and a wafer; a tape supplying device that
supplies a continuous dicing tape or a continuous carrier tape to which a
precut dicing tape is joined, to a joining position; a joining unit that
joins the continuous dicing tape or the precut dicing tape separated from
the carrier tape, to the ring frame and the semiconductor wafer; a tape
cutting mechanism that cuts the dicing tape joined to the ring frame
along a contour of the ring frame; and a residual tape collecting section
that takes up and collects a residual tape after the cutting.