An electronic component generates heat in an electronic apparatus. The heat of the electronic component is transferred to a thermal conductive plate of a heat receiver in a liquid cooling unit. The heat is transferred to coolant from the thermal conductive plate. The temperature of the coolant rises. The heat exchanger absorbs heat of the coolant. The coolant gets cooled. The heat of the electronic component is also transferred to the printed wiring board. The heat spreads over the printed wiring board through a wiring pattern in the printed wiring board. Since the tank or/and pump is placed at a position outside the printed wiring board, the heat cannot be transferred to the tank or/and the pump. This results in prevention of rise in the temperature of the coolant in the tank or/and the pump. The efficiency of heat radiation can thus be enhanced.