An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, ##STR00001## wherein each of R.sub.1 through R.sub.7, independently, represents a hydrogen atom or a C.sub.1-C.sub.12 hydrocarbon group, provided that when R.sub.1 through R.sub.7 are C.sub.1-C.sub.12 hydrocarbon groups, R.sub.1 and R.sub.2, R.sub.2 and R.sub.3, R.sub.3 and R.sub.4, R.sub.4 and R.sub.5, R.sub.5 and R.sub.6, and R.sub.6 and R.sub.7 can be joined to each other to form a cyclic structure.