A curing resin composition which enables formation of an antireflection layer having good antiscratchability and a cured film obtained from such a curing resin composition are disclosed. The curing resin composition contains (A) a siloxane oligomer having an average molecular weight of 500-10000 in terms of ethylene glycol and (B) a fluorine compound having a number-average molecular weight of 5000 or more in terms of polystyrene and having a fluoroalkyl structure and a polysiloxane structure.

 
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> Pipe coupler

> Wired circuit board

~ 00585