A method and system are provided for determining whether a spectrophotometric sensor is misapplied. In one embodiment, a spectrophotometric sensor is provided with a strain sensor configures to provide a signal related to the curvature of the spectrophotometric sensor. In such an embodiment, the signal may be compared, such as by an associated monitor, with an expected signal value. Based upon this comparison, a determination may be made whether or not the spectrophotometric sensor is misapplied.