A magnetic head includes a wafer substrate and a conductive underlayer formed directly on the substrate. An insulating layer is formed above the conductive layer. A reader and/or writer thereof is formed above the insulating layer. Another magnetic head includes a substrate and an insulating underlayer formed above the substrate. A conductive underlayer is formed above the insulating underlayer. An insulating layer is formed above the conductive underlayer. At least one device is formed above the insulating layer, the at least one device being selected from a group consisting of readers, writers, and combinations thereof. Tape drive systems and methods for forming such heads are also presented.