An imaging system is provided having an EMI shield configured to shield one or more imaging components. The EMI shield includes a first material having a first plurality of conductive elements integrally formed within a first nonconductive material and also includes a generally nonconductive exterior. A method is provided for shielding EMI in an imaging system. The method includes providing an EMI shielding enclosure that includes a first material having a first plurality of conductive elements disposed in a first non-conductive material, and a second material having a second plurality of conductive elements disposed in a second non-conductive material, wherein the first plurality of conductive elements engages the second plurality of conductive elements to form a conduction path. Another method for shielding EMI in an imaging system is provided, that includes providing an EMI shielding enclosure having a first material that has a non-conductive surface and a second EMI shielding material disposed on the non-conductive surface of the first material.