A testing apparatus and a method for detecting a contact deficiency of an
electrically conductive connection. The testing apparatus comprises a
measuring chamber, in which several system elements of the connection
that are connected in an electrically conductive fashion are positioned,
a heat radiator that is supplied with energy and the transferred thermal
radiation of which is emitted into the measuring chamber and directed
toward the region of the system elements that, after having been heated,
generate a thermal field of the insulated and the metallic system
components of these connected system elements, a thermal (image)
acquisition unit for optically capturing the generated thermal field and
for realizing a signal conversion into a thermal image of the connected
system elements, and a thermal (image) reproduction unit for the visual
reproduction of the converted thermal image.