A silane resin that can be structured photochemically and/or thermally is obtained by at least partial condensation of a mixture of a) at least one silane compound R.sub.aR.sup.2.sub.bSiX.sub.4-a-b wherein R is a group polymerizable photochemically and/or thermally via an organic group by radical or cationic polymerization; R.sup.2 is a straight-chain, branched, or cyclic C.sub.1-C.sub.12 alkyl group; X is identical or different and is a leaving group; a is 1 or 2; b is 0 or 1; a+b is not more than 2; and b) at least one silanediol R.sup.1.sub.2Si(OH).sub.2 wherein R.sup.1 is identical or different and is a straight-chain, branched, or cyclic C.sub.1-C.sub.12 alkyl group or a group polymerizable photochemically and/or thermally via an organic group by radical or cationic polymerization, provided the group does not contain aryl. The silane resins have dielectric properties useful in extremely high frequency applications.