Systems and methods of double diamond clock and power distribution. In accordance with a first embodiment of the present invention, an integrated circuit comprises a first metallization layer. that is substantially a power plane and a second metallization layer disposed immediately adjacent to the first metallization layer. The first metallization layer and the second metallization layer are separated by an inter-plane distance. A signal trace on the first metallization layer is separated from the power plane by about three times the inter-plane distance.