A modified polyimide resin favorably employable for manufacturing an insulation film of an electric-electronic device is composed of recurring units (I) derived from a biphenyltetracarboxylic acid compound, a diamine compound, and a monoamine compound having at least one hydroxyl group and recurring units (II) derived from diisocyanate and polybutadiene having hydroxyl group at each terminal, which optionally contains further recurring units (III) derived from diisocyanate and a compound having hydroxyl group at each terminal and further having a reactive substituent.