A device manufacturing apparatus includes a conveying device which conveys a substrate, an acquiring device to acquire an amount of warpage of the substrate, based on a measurement or an input, a storing device which stores a database representing a correspondence between a parameter related to a conveying condition and the warpage amount of the substrate, and a controller which controls, based on the database, the conveying device to convey the substrate in accordance with a parameter corresponding to the warpage amount acquired by the acquiring device.