The present invention is directed to a probe head having a probe contactor
substrate with at least one slot that passes through the probe contactor
substrate, at least one probe contactor adapted to test a device under
test, with the probe contactor being coupled to the a top side of the
probe contactor substrate and electrically connected to a terminal also
disposed on top of the probe contactor substrate, and a space transformer
having at least one bond pad coupled to a top side of the space
transformer, and a bond interconnect which electrically couples the bond
pad to the terminal through the slot in the probe contactor substrate.