The present invention provides electrodeposited copper foil with a carrier
foil which permits the formation of finer-pitch circuits and also enables
the multilayer process to be easily performed to meet the requirements
for recent printed wiring boards. According to the invention, there is
provided electrodeposited copper foil with a carrier foil in which an
adhesive interface layer is formed on a surface of the carrier foil and
an electrodeposited copper foil layer is formed on the adhesive interface
layer, which is characterized in that the electrodeposited copper foil
layer is provided with a passivated layer formed without performing
roughening treatment as nodular treatment and that a nickel-zinc alloy
consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by
weight is adopted as the passivated layer.