A mold for imprint capable of forming a reduced seam or seamless pattern, on a surface of a substrate, having larger area than that of the mold includes a first pattern area comprising a plurality of first recesses; and a second pattern area, comprising a plurality of second recesses, for being used as an alignment mark. The first pattern area and the second pattern area have an equal height at their outermost surfaces. The first recesses and the second recesses have different depths. The first pattern area and the second pattern area have an equal cyclic interval.