A heat dissipation apparatus (10) includes a heat spreader (30), and first and second resilient plates (40, 50) provided at two opposite sides of the heat spreader. The first resilient plate includes a mounting arm (41) and two fixing arms (42) extending from two opposite ends of the mounting arm, respectively. The mounting arm defines a first mounting hole (43) therein, and each of the fixing arms defines a first fixing hole (44) therein. The second resilient plate defines a second mounting hole (53) and two second fixing holes (54) therein. The first resilient plate is fixed on the heat spreader via the first fixing holes. The second resilient plate is fixed on the heat spreader via the second fixing holes. The heat spreader is fixed on a circuit board via the first and the second mounting holes.